High Performance Target Market Size, Share, Growth Report 2026–2036

Global High Performance Target Market Overview

The Global High Performance Target Market is positioned for significant growth over the coming decade. According to Western Market Research, the market was valued at approximately USD 5.8 billion in 2025 and is projected to reach approximately USD 13.5 billion by the end of 2036, reflecting a compound annual growth rate (CAGR) of 8.0% during the forecast period.

This comprehensive report provides an in-depth analysis of the industry's developmental trajectory, including emerging patterns, supply chain dynamics, and market valuation. The study employs a rigorous methodology, combining extensive primary research (interviews with industry experts, material scientists, and key opinion leaders) with robust secondary research (analysis of annual reports, trade journals, patent filings, and government databases). It evaluates critical parameters influencing the market, such as evolving government regulations on material purity, macroeconomic conditions affecting electronics manufacturing, competitive intensity among global players, technological progress in sputtering techniques, and post-pandemic recovery trends in key end-use sectors.

What are High Performance Targets?
High performance targets, also known as sputtering targets, are high-purity materials used in physical vapor deposition (PVD) processes to create thin films on substrates such as silicon wafers, glass panels, and optical components. These targets are critical enablers of modern technology, as the thin films they produce provide essential electrical, optical, magnetic, and protective properties to a vast range of products.

Impact of COVID-19 on the High Performance Target Market

The COVID-19 pandemic had a complex impact on the high performance target market. Initial global lockdowns in 2020 disrupted manufacturing operations, particularly in the automotive and consumer electronics sectors, leading to supply chain bottlenecks and project delays. However, the pandemic also accelerated several long-term demand drivers. The surge in remote work and digitalization fueled unprecedented demand for semiconductors, data centers, and consumer electronics, all of which rely heavily on sputtering targets for chip manufacturing and display production. This created a robust recovery and sustained growth trajectory from 2021 onwards, highlighting the market's critical role in the global technology infrastructure.

Market Segmentation Analysis

To provide a granular view of the market landscape, the report segments the High Performance Target market based on Material Type, Shape, Application, and End-Use Industry.

By Material Type

• Metal Targets: This segment includes pure metals such as aluminum (Al), copper (Cu), titanium (Ti), tantalum (Ta), molybdenum (Mo), and precious metals like gold (Au) and silver (Ag). Metal targets are widely used for creating conductive layers in semiconductors, electrodes in displays, and reflective coatings in architectural glass. Tantalum and copper targets, in particular, are experiencing high demand due to their critical role in advanced semiconductor node interconnects. Molybdenum targets are essential for transistor gates and display electrodes.

• Ceramic Targets: These include oxides, nitrides, silicides, and fluorides. Key materials are Indium Tin Oxide (ITO), Aluminum-doped Zinc Oxide (AZO), Silicon Dioxide (SiO2), Titanium Nitride (TiN), and Silicon Nitride (Si3N4). ITO targets are indispensable for producing transparent conductive electrodes in flat panel displays and touch screens due to their unique combination of electrical conductivity and optical transparency. The growth of high-resolution displays and solar cells is a primary driver for this segment.

• Alloy Targets: These are engineered mixtures of metals, such as nickel-chromium (NiCr), aluminum-copper (AlCu), silicon-aluminum (SiAl), cobalt-iron-boron (CoFeB), and nickel-platinum (NiPt). Alloy targets are used to deposit films with specific tailored properties, such as precise electrical resistance, enhanced corrosion resistance, or specialized magnetic characteristics for applications in data storage (hard disk drives) and advanced semiconductor packaging.

By Shape

• Rotary Targets: Cylindrical targets that rotate during the sputtering process, offering higher material utilization (often >80%), improved film uniformity, and reduced arcing compared to planar targets. They are increasingly preferred for large-area coatings, particularly in display and architectural glass manufacturing.

• Planar Targets: Traditional rectangular or circular targets that remain stationary. They are widely used in semiconductor and various industrial coating applications. While they have lower material utilization (typically 30-40%), they are well-established and suitable for many processes.

By Application

• Semiconductor: This is the largest and most technologically demanding application segment. High-purity targets are used to deposit multiple thin film layers (conductive, barrier, seed, and dielectric layers) during the fabrication of integrated circuits. As semiconductor nodes shrink to 3nm and below, the requirements for target purity (99.9999% or 6N and higher), fine grain size, and defect control become extremely stringent, driving demand for premium targets.

• Flat Panel Display: This segment consumes a significant volume of targets, primarily ITO and molybdenum (Mo), for manufacturing LCD, OLED, and emerging microLED displays used in televisions, monitors, laptops, smartphones, and wearables. The trend towards larger screen sizes, higher resolutions (4K/8K), and flexible/form-factor displays increases the consumption of target materials per panel and creates demand for new materials.

• Solar Cell: Targets are used to deposit transparent conductive oxide (TCO) layers (e.g., ITO, AZO, IZO) and back contact layers (e.g., molybdenum, aluminum) in thin-film solar cells (CdTe, CIGS) and silicon heterojunction (SHJ) cells. The global push for renewable energy and emerging tandem cell technologies present significant opportunities.

• Touch Screen: The proliferation of touch-enabled devices from smartphones and tablets to interactive kiosks and automotive infotainment systems drives demand for ITO and other transparent conductive targets for sensor layers.

• Recording Medium: While a mature segment, it remains relevant for hard disk drives (HDDs). Targets are used to deposit magnetic layers (e.g., CoCrPt alloys) and protective overcoats (e.g., carbon) required for high-density data storage.

• Optical Data Storage & Other Applications: This includes targets for coating data storage discs (CDs, DVDs, Blu-ray), decorative coatings on consumer goods, functional coatings on automotive components (e.g., sensors, mirrors), and precision optical coatings for lenses and mirrors in aerospace, defense, and medical devices.

By End-Use Industry

• Electronics & Semiconductor Manufacturing: The dominant end-user, encompassing semiconductor foundries, IDMs (Integrated Device Manufacturers), display panel makers, and manufacturers of passive components and PCBs.

• Energy (Solar Power): Manufacturers of photovoltaic cells and panels.

• Automotive: Increasingly relevant for sensors, displays, power electronics in electric vehicles (EVs), and advanced driver-assistance systems (ADAS).

• Aerospace & Defense: For precision optical coatings, thermal management coatings, and protective coatings on critical components.

• Data Storage: Manufacturers of HDDs and other magnetic media.

• Medical Devices: For applying biocompatible coatings and functional layers on implants and diagnostic equipment.

Regional Analysis

The global High Performance Target market exhibits distinct characteristics across different geographic regions.

• Asia-Pacific (China, Japan, South Korea, Taiwan, India, Southeast Asia): This region is the undisputed growth engine and largest market, accounting for over 65% of global demand. Its dominance is driven by the concentration of semiconductor foundries (Taiwan, South Korea), display panel manufacturers (China, South Korea, Japan), and consumer electronics assembly (China, Vietnam). China, in particular, is investing heavily in domestic semiconductor and display production, creating immense demand. Japan and South Korea are home to leading target material producers and advanced technology developers. The region benefits from a complete ecosystem, from raw material processing to end-device manufacturing.

• North America (U.S., Canada, Mexico): A mature and technologically advanced market. The U.S. is home to major semiconductor IDMs (like Intel, Micron) and equipment manufacturers, driving demand for cutting-edge, high-purity targets for leading-edge nodes and memory production. The region also has a strong aerospace and defense sector requiring precision optical coatings. Near-shoring trends in semiconductor manufacturing (CHIPS Act) are expected to bolster market growth for domestic target suppliers.

• Europe (Germany, France, UK, Italy, Netherlands): Europe has a strong presence in automotive electronics, industrial equipment, and specialty materials. Germany, as an automotive powerhouse, drives demand for sensors, power electronics (SiC, GaN), and display panels for premium vehicles. The region also has a robust ecosystem for research and development in materials science and advanced manufacturing, with key players in specialty metals and equipment.

• South America (Brazil, Argentina): A smaller but developing market. Growth is tied to the expansion of local electronics assembly, automotive production, and potential investments in renewable energy infrastructure, particularly solar.

• Middle East & Africa (GCC, South Africa): An emerging market with nascent high-tech manufacturing. Growth potential exists in diversifying economies, particularly in the GCC region, with strategic investments in technology hubs and large-scale solar energy projects.

Porter's Five Forces Analysis

• Threat of New Entrants (Moderate): The market presents significant barriers, including the need for specialized metallurgical and ceramic expertise, substantial capital investment in purification and manufacturing equipment (e.g., vacuum melting, hot isostatic pressing, cleanrooms), and a complex, lengthy qualification process with end-users (often 1-3 years for semiconductor applications). However, niche opportunities in less critical applications and regional markets may attract new players, and supportive government policies (e.g., local content requirements) could lower barriers in specific regions.

• Bargaining Power of Buyers (Moderate to High): Large semiconductor and display manufacturers purchase targets in high volumes and have stringent quality requirements. They often qualify 2-3 suppliers per material to ensure supply chain resilience, giving them leverage in price negotiations, particularly for more commoditized target types. However, for highly specialized, custom-engineered targets for advanced nodes, supplier power increases due to the technical complexity and co-development involved.

• Bargaining Power of Suppliers (Moderate): Suppliers of high-purity raw materials (e.g., refined metals like tantalum, indium, rare earths) have moderate power. The prices of these raw materials can be volatile and are influenced by geopolitical factors and mining outputs. Target manufacturers often integrate backward into refining or secure long-term supply agreements with miners and refiners to mitigate this risk.

• Threat of Substitutes (Low): For mainstream PVD applications, sputtering is a well-established, high-performance technology offering excellent film uniformity, composition control, and scalability. While alternative deposition methods like thermal evaporation, CVD (Chemical Vapor Deposition), and ALD (Atomic Layer Deposition) exist, they are often complementary or suited for different applications rather than direct substitutes. The threat of substitution is low for the core function of creating high-quality, uniform thin films of metals, alloys, and ceramics at scale.

• Industry Rivalry (High): Rivalry is intense among established global players and specialized regional competitors. Competition is based on material purity, grain size control, defect density, technological innovation (e.g., for next-gen nodes and materials), supply reliability, and long-term customer relationships. The industry is characterized by consolidation, strategic partnerships with equipment makers and end-users, and continuous R&D investment.

SWOT Analysis

• Strengths:

  • Enabling Technology: Targets are essential, non-negotiable consumables for manufacturing virtually all modern electronic, optical, and functional coated devices, ensuring consistent and critical demand.

  • High Technical Barriers: Deep expertise in metallurgy, ceramics, purification, and precision machining creates a strong competitive moat for established players.

  • Long-Term Customer Relationships: Lengthy and expensive qualification processes create "stickiness" and lead to long-term supply agreements with major fabs, panel makers, and other industrial coaters.

• Weaknesses:

  • Raw Material Dependency & Price Volatility: Profitability can be significantly impacted by price fluctuations and supply chain risks for specialty and critical metals (e.g., indium, tantalum, rare earths, precious metals).

  • High R&D Costs: Continuous and substantial investment is required to develop targets for new materials, shrinking technology nodes, and emerging applications.

  • Capital Intensive Nature: Manufacturing requires sophisticated and expensive equipment for melting, forging, rolling, machining, and cleanroom processing, leading to high fixed costs.

• Opportunities:

  • Semiconductor Megatrends: Unprecedented growth in AI, HPC (High-Performance Computing), 5G/6G, and IoT is driving demand for advanced chips with more layers and smaller features, requiring more targets per wafer and more challenging materials.

  • Electric Vehicle (EV) Revolution: EVs use significantly more semiconductors than traditional cars (for power management, battery management, infotainment, ADAS) and require power electronics (SiC, GaN) that rely on specific thin films and contacts.

  • Advanced Display Technologies: The transition to OLED, QLED, and microLED displays creates demand for new and higher-purity target materials and more complex layer stacks.

  • Renewable Energy Expansion: Growth in solar panel manufacturing, particularly thin-film and heterojunction technologies, presents a significant and growing opportunity for TCO and back contact targets.

  • Circular Economy Initiatives: Developing robust recycling processes for spent targets ("target scrap") can reduce raw material costs, enhance supply security, and provide a strong sustainability narrative.

• Threats:

  • Geopolitical Supply Chain Risks: Concentration of raw material sources (e.g., China for rare earths and indium refining, DRC for cobalt) and advanced manufacturing capacity (e.g., Taiwan for leading-edge semiconductors) creates vulnerability to trade disputes, export controls, and regional instability.

  • Technological Disruption: While unlikely in the near to medium term, a paradigm shift in deposition technology or the emergence of a completely new device architecture could disrupt or reduce demand for current sputtering target types.

  • Economic Cyclicality: The market is cyclical and sensitive to downturns in the consumer electronics, automotive, and memory chip markets, which can lead to sudden inventory corrections and reduced fab utilization.

Key Market Trends

• Relentless Drive for Ultra-High Purity and Microstructure Control: As semiconductor nodes shrink to 2nm and below and display resolutions increase, the demand for targets with purity levels of 6N (99.9999%) and even 7N, along with extremely fine and uniform grain size and minimal defect densities, is accelerating. This pushes manufacturers to invest in advanced refining, vacuum melting, and clean-room manufacturing.

• Miniaturization and 3D Architectures: The transition to gate-all-around (GAA) transistors, backside power delivery networks, and 3D NAND memory with hundreds of layers requires the deposition of ultra-thin, conformal films in high aspect ratio structures. This demands new target materials (e.g., novel alloys, high-k metal gates) and optimized sputtering processes.

• Rise of Wide-Bandgap Semiconductors (SiC and GaN): The rapid adoption of silicon carbide (SiC) and gallium nitride (GaN) power semiconductors for EVs, fast chargers, and industrial power supplies creates new requirements for metal contacts (e.g., ohmic contacts), barrier layers, and interconnects, driving demand for associated specialized targets.

• Material Innovation for Advanced Displays: The development of microLED and OLED displays requires new target materials for improved efficiency, color purity, and flexibility. This includes novel transparent conductive oxides (beyond ITO), thin-film encapsulation materials, and metal alloys for interconnects.

• Circular Economy and Target Recycling: With rising raw material costs and increasing supply chain concerns, there is a growing focus on recovering and recycling target materials from spent targets. This involves de-bonding the target from the backing plate and reprocessing the remaining material. This is becoming a key sustainability initiative and a strategic source of raw materials.

• Localization and Regionalization of Supply Chains: In response to geopolitical tensions and the supply chain disruptions highlighted by the pandemic, major economies like the U.S., EU, Japan, and China are implementing policies and providing funding to boost domestic semiconductor and display manufacturing. This will drive demand for locally sourced targets and encourage target manufacturers to establish production facilities in these regions.

Market Drivers and Challenges

• Market Drivers:

  1. Explosive Growth in Semiconductor Demand: The proliferation of AI, high-performance computing, cloud data centers, 5G/6G infrastructure, and billions of smart connected devices is the primary, non-negotiable driver, directly increasing wafer starts and, consequently, target consumption per wafer.

  2. Expansion of Display Manufacturing Capacity: Major ongoing and planned investments in new generation fabs for large-area OLED and LCD/LED panels, particularly in China, are driving volume demand for ITO, molybdenum, and other critical targets.

  3. Electrification of Transportation and Automotive Technology: The automotive industry's fundamental shift to EVs, coupled with the increasing sophistication of ADAS and in-vehicle infotainment, significantly increases semiconductor and sensor content per vehicle, driving long-term demand.

  4. Proliferation of Smart Devices and IoT: The continuous growth in wearables, smart home devices, industrial IoT sensors, and other connected gadgets fuels demand for displays, touch screens, and semiconductors, all of which require sputtering targets.

• Market Challenges:

  1. Supply Chain Vulnerability for Critical and Specialty Metals: Dependence on a limited number of countries and even specific mining operations for key raw materials like indium (for ITO), tantalum (for barrier layers), and rare earth metals creates significant supply and price volatility risk.

  2. Intense and Accelerating Technological Pressure: Keeping pace with the relentless advancement of semiconductor (Moore's Law) and display technologies requires substantial, continuous, and often risky R&D investment. A single misstep in materials development can cost a supplier its position.

  3. Stringent and Lengthy Customer Qualification Processes: Gaining approval from a major semiconductor manufacturer for a new target material or supplier is a long (1-3+ years) and extremely expensive process, representing a formidable barrier, especially for new entrants and new materials.

  4. Environmental and Safety Regulations: Manufacturing high-performance targets involves processes like melting, machining, and chemical treatments that are subject to stringent environmental and occupational safety regulations, adding to operational costs and complexity.

Value Chain Analysis

1. Upstream (Raw Material Sourcing & Refining): The value chain begins with mining and primary extraction of ores. This is followed by complex and energy-intensive refining and purification processes to achieve the ultra-high purity levels (4N to 6N+) required for target manufacturing. This stage is often dominated by specialized chemical and metal refining companies or integrated mining giants. Key raw materials include aluminum, copper, titanium, tantalum, indium, tin, rare earths, and precious metals.

2. Midstream (Target Manufacturing): This critical stage involves converting high-purity raw materials into a finished target. Key processes include:

   • Alloying/Formulation: For alloy and ceramic targets, precise ratios of elements are mixed.

   • Melting & Casting: Using techniques like vacuum arc melting, vacuum induction melting, or hot isostatic pressing (HIP) to create a dense, homogenous, and porosity-free billet with controlled grain structure.

   • Powder Metallurgy: For refractory metals or materials with high melting points, powders are pressed and sintered to form a solid billet.

   • Metalworking & Precision Machining: The billet is then forged, rolled, annealed, and CNC-machined to exacting dimensional tolerances and surface finish specifications.

   • Bonding: For many targets, especially for high-power applications, the target material is bonded (soldered, brazed, or diffusion bonded) to a high-strength, high-conductivity backing plate (often copper or an alloy) which provides mechanical support and efficient cooling during sputtering.

   • Cleaning & Packaging: Finished, bonded targets undergo rigorous multi-step cleaning in cleanroom environments (Class 100 or better) to remove any particulate or chemical contamination before being vacuum-sealed in specialized, particle-free packaging for shipment.

3. Downstream (Distribution & End-Use): Targets are sold directly (common in semiconductor industry) or through specialized distributors to end-users:

   • Semiconductor Fabs & Foundries: Use targets in PVD tools for wafer processing. This is the most demanding segment with the highest purity and quality requirements.

   • Display Panel Makers: Use large-area planar or rotary targets for coating glass substrates.

   • Other Industrial Coaters: Apply thin films for solar panels, data storage media, architectural glass, automotive components, and decorative finishes. A small but important part of the downstream is spent target recycling, where end-users return used targets (the remaining material on the backing plate) to manufacturers or specialist recyclers for material recovery, creating a circular loop back to the upstream/midstream stages.

Top Key Players Covered in the High Performance Target Market

The competitive landscape is characterized by a mix of global diversified technology companies, specialized metallurgical firms, and regional players, particularly in Asia.

Global Leaders & Diversified Technology Companies:

• Honeywell (USA): A major supplier of high-purity electronic materials, including a comprehensive range of sputtering targets for the semiconductor industry, leveraging its expertise in specialty chemicals and metals.

• Sumitomo Chemical / Sumitomo Metal Mining (Japan): A key Japanese conglomerate with a dominant position in semiconductor materials, offering a wide portfolio of sputtering targets, including ITO and high-purity metals.

• Mitsui Mining & Smelting (Japan): A leading supplier of sputtering targets, particularly strong in ITO and other display-related materials.

• JX Nippon Mining & Metals Corporation (Japan): A world leader in refined metals and high-purity sputtering targets, with an extensive portfolio for semiconductors, displays, and data storage.

• Tosoh SMD (USA/Japan): A globally recognized leader and pioneer in the design and manufacture of sputtering targets, particularly renowned for its advanced technology for semiconductor, magnetic media, and display applications.

• Praxair (now part of Linde plc) (USA): A leading industrial gas company with a significant materials business that included a wide range of sputtering targets for various industrial applications.

• ULVAC, Inc. (Japan): A major vacuum equipment manufacturer that is also a significant producer of a wide range of sputtering targets, offering integrated solutions for its customers.

• Plansee SE (Austria): A world-leading manufacturer of refractory metals (molybdenum, tungsten, tantalum, niobium) and their alloy products, including high-performance sputtering targets.

• Materion Corporation (USA): A leading supplier of advanced materials, including ultra-high-purity sputtering targets for semiconductor, aerospace, defense, and industrial applications, with strong expertise in precious metals and specialty alloys.

Specialized & Prominent Regional Players:

• Nikko Materials (Japan) – now part of JX Nippon Mining & Metals

• Williams Advanced Materials (part of Materion) (USA)

• Heraeus Group (Germany): A diversified technology company with a strong portfolio of precious and specialty metals, including sputtering targets for various high-tech applications.

• Fujimi Incorporated (Japan): Known for high-purity materials and targets, particularly for the electronics and semiconductor industries.

• Konfoong Materials International (China): A leading and rapidly growing Chinese supplier of sputtering targets, strongly benefiting from the localization trend and government support for the domestic semiconductor industry.

• Ningxia Orient Tantalum Industry (OTIC) (China): A major global producer of tantalum and niobium materials, including sputtering targets, leveraging its captive raw material source.

• Lida Optical and Electronic (China): Specializes in high-purity targets for optical and electronic applications, serving the growing domestic market.

• GRIKIN Advanced Materials (China): A prominent Chinese supplier of high-purity sputtering targets for semiconductors, displays, and optics.

• Fujian Acetron New Materials (China): A specialized manufacturer of high-purity metal and alloy sputtering targets.

• ANP Materials (China)

• Acetron (South Korea)

• KJLC (Kurt J. Lesker Company) (USA): A global supplier of vacuum equipment and a wide range of deposition materials, including sputtering targets for R&D and various industrial applications.

Quick Recommendations for Stakeholders

• For Manufacturers:

  • Invest in Advanced R&D and Materials Science: Aggressively focus R&D on developing targets for next-generation technologies (e.g., GAA transistors, backside power delivery, microLEDs, solid-state batteries) to stay ahead of the technology curve, secure early design wins, and command premium pricing.

  • Secure and Diversify Critical Raw Material Sourcing: Establish long-term, strategic partnerships with miners and refiners, invest in geographically diverse sources, and significantly ramp up investment in recycling technologies for spent targets and manufacturing scrap to mitigate supply chain risks and cost volatility.

  • Embrace Industry 4.0 and Sustainability: Implement AI and machine learning for process optimization, predictive maintenance, and quality control. Proactively develop and market "greener" targets made with recycled content or lower carbon footprint processes to meet customer ESG goals and gain a competitive edge.

  • Strengthen Customer Partnerships: Move beyond a supplier-customer relationship to become a true technology partner. Engage in deep, collaborative co-development programs with leading fabs, display makers, and equipment manufacturers to solve their most challenging thin-film problems.

• For Investors:

  • Focus on Companies with Material Science and High-Purity Expertise: Look for companies with proven, deep metallurgical and ceramic capabilities, strong intellectual property portfolios, and a track record of successfully qualifying materials for leading-edge nodes. These players are best positioned to serve the most demanding and profitable segments.

  • Monitor Semiconductor and Display Capex Cycles Closely: Investment in new wafer fabs (especially leading-edge logic and memory) and display panel plants (Gen 10.5+ for LCD, new OLED/microLED fabs) is the most reliable leading indicator for future target demand. Track capital expenditure announcements meticulously.

  • Assess Geographic Diversification and Supply Chain Resilience: Favor companies with a diversified manufacturing footprint, multiple sourcing options for critical raw materials, and a clear strategy for navigating geopolitical trade tensions. Companies exposed to a single region or raw material source carry higher risk.

  • Evaluate Commitment to R&D and Recycling: Analyze R&D spending as a percentage of revenue and its focus areas. Also, assess investments and capabilities in recycling, as this will become an increasingly important strategic and financial asset.

• For End-Users (Semiconductor Fabs, Display Makers, Industrial Coaters):

  • Proactively Qualify Multiple and Geographically Diverse Suppliers: Ensure long-term supply chain resilience by qualifying and maintaining at least two, ideally three, suppliers for every critical target material, ensuring they are not all located in the same geopolitical region.

  • Deepen Technical Collaboration and Co-Development: Engage target suppliers early in the process technology development phase for new nodes or new products. Co-development can lead to optimized target designs (grain size, chemistry), improved deposition uniformity and rate, faster process qualification, and ultimately, better device performance and yield.

  • Evaluate Total Cost of Ownership (TCO) Holistically: When selecting suppliers, look beyond the initial purchase price. Consider a comprehensive TCO model that includes target lifetime (thickness and erosion profile), deposition rate, particle and defectivity performance, consistency across batches and targets, and the potential value of a take-back/recycling program. A slightly more expensive target that lasts longer and defects less can significantly lower overall fab operating costs.

  • Incorporate Sustainability Criteria: Include supplier sustainability practices, such as use of recycled materials, carbon footprint, and end-of-life take-back programs, as part of the supplier qualification and selection process to meet your own corporate ESG commitments.