Epoxy Molding Compounds Market
The Epoxy Molding Compounds (EMC) Market is a specialized sector that focuses on the production and application of epoxy resin-based materials used in molding processes. EMCs are critical in industries requiring materials with high thermal stability, mechanical strength, and chemical resistance, such as electronics, automotive, and aerospace.
Epoxy Molding Compounds (EMCs) are advanced materials composed primarily of epoxy resins, combined with fillers, hardeners, and other additives. These compounds are specifically formulated to offer excellent mechanical strength, thermal stability, and chemical resistance, making them essential for a variety of high-performance applications.
The global Epoxy Molding Compounds (EMC) market was valued at approximately USD 2.3 billion in 2022 and is projected to reach around USD 3.8 billion by 2030, growing at a compound annual growth rate (CAGR) of about 7% during the forecast period
This growth is primarily driven by the increasing demand for advanced electronics, particularly in semiconductor encapsulation, consumer electronics, and automotive sectors. EMC is essential in these industries for its heat resistance, corrosion resistance, and thermal conductivity properties, which make it ideal for protecting sensitive electronic components
| Report Attributes | Details |
| Study Period | 2023 to 2033 |
| Base Year | 2023 |
| FORECAST PERIOD | 2024-2030 |
| HISTORICAL PERIOD | 2020-2023 |
| UNIT | Value (USD Billion) |
| KEY COMPANIES PROFILED | Sumitomo Bakelite Hitachi Chemical Chang Chun Group Hysol Huawei Electronics Panasonic Kyocera KCC Samsung SDI Eternal Materials Jiangsu Zhongpeng New Material Shin-Etsu Chemical Hexion Nepes Tianjin Kaihua Insulating Material HHCK Others |
| SEGMENTS COVERED | By Type, By Application, and By Geography |
| CUSTOMIZATION SCOPE | Free report customization (equivalent to up to 4 analyst’s working days) with purchase. Addition or alteration to country, regional & segment scope. |
Furthermore, the shift towards more environmentally friendly, halogen-free compounds and the rising complexity of electronic devices are also contributing to the market's expansion
Key Properties of EMCs:
High Thermal Resistance: Withstand extreme temperatures, making them ideal for electronics and automotive applications.
Mechanical Strength: Provide robust protection against mechanical stress.
Chemical Resistance: Offer protection against moisture, acids, and other environmental factors.
Electrical Insulation: Excellent dielectric properties make them suitable for encapsulating sensitive electronic components.
Low Shrinkage: Ensure dimensional stability during curing and long-term use.
Applications:
Electronics: Used in encapsulating semiconductors, microchips, and transistors to protect against mechanical damage, moisture, and corrosion.
Automotive: Applied in sensors, LED lighting, and electrical control units for reliability in harsh environments.
Aerospace: Provide heat and mechanical resistance for critical components.
Renewable Energy: Used in solar panels and wind turbines for structural durability.
Manufacturing and Types:
EMCs are usually thermosetting compounds, which means they cure into a hard, inflexible material when exposed to heat or UV light.
Custom formulations are available to meet specific needs, such as flame retardancy or enhanced thermal conductivity.
Importance in Industry:
Epoxy molding compounds are indispensable in industries requiring high-performance materials, particularly for protecting sensitive electronic devices and achieving lightweight, durable components in automotive and aerospace applications. Their versatility and superior properties make them a cornerstone in modern manufacturing and technology.
Key Highlights of the Epoxy Molding Compounds Market:
Market Dynamics:
Growth Drivers:
Rising demand for lightweight and durable materials in electronics and automotive sectors.
Increased adoption of epoxy molding compounds in encapsulating and protecting semiconductors and microelectronics.
Rapid industrialization in developing economies fueling EMC usage across multiple applications.
Restraints:
High raw material costs and complexities in manufacturing.
Environmental concerns related to the disposal of epoxy materials.
Applications:
Electronics: EMCs are extensively used in chip encapsulation, printed circuit boards (PCBs), and other electronic components for insulation and durability.
Automotive: Increasing applications in electronic sensors, LED lighting, and structural parts due to their lightweight and robust properties.
Aerospace: EMCs are utilized for components requiring high resistance to temperature and mechanical stress.
Material Types:
Thermosetting compounds dominate the market due to their superior strength and stability compared to thermoplastics.
Custom formulations for specific applications, including flame-retardant or electrically conductive EMCs, are gaining traction.
Regional Insights:
Asia-Pacific: The largest market, driven by the region's dominance in electronics manufacturing and automotive production.
North America and Europe: Witnessing growth due to advancements in aerospace and high-end electronics applications.
Emerging Trends:
Development of eco-friendly and recyclable EMCs to address environmental concerns.
Increasing adoption of EMCs in renewable energy systems like wind turbines and solar panels.
Competitive Landscape: Key players in the market include Sumitomo Bakelite Co., Ltd., Hitachi Chemical Co., Ltd., Samsung SDI Co., Ltd., and Kyocera Corporation. These companies focus on innovation, sustainability, and strategic partnerships to maintain a competitive edge.
Future Outlook:
The EMC market is poised for sustained growth, with increasing demand for high-performance materials in electronics, automotive, and renewable energy industries. Research and development in bio-based epoxy materials and innovative formulations will play a pivotal role in shaping the market's future trajectory.
Epoxy Molding Compounds Market Segments
By Type
Normal epoxy molding compound
Green epoxy molding compound
By End-User/Application
Semiconductor encapsulation
Electronic components
By Industry Vertical
Electrical
Automotive
Aerospace
Others
Epoxy Molding Compounds Market Players
Sumitomo Bakelite
Hitachi Chemical
Chang Chun Group
Hysol Huawei Electronics
Panasonic
Kyocera
KCC
Samsung SDI
Eternal Materials
Jiangsu Zhongpeng New Material
Shin-Etsu Chemical
Hexion
Nepes
Tianjin Kaihua Insulating Material
HHCK
Others
Table of Contents
Chapter 1. Preface
1.1 Report Description and Scope
1.2 Research scope
1.3 Research methodology
1.3.1 Market Research Type
1.3.2 Market research methodology
Chapter 2. Executive Summary
2.1 Global Epoxy Molding Compound Market, (2022 – 2030) (USD Million)
2.2 Global Epoxy Molding Compound Market: snapshot
Chapter 3. Global Epoxy Molding Compound Market – Industry Analysis
3.1 Epoxy Molding Compound Market: Market Dynamics
3.2 Market Drivers
3.2.1 Better Alternative To Conventional Resin Molding Materials
3.2.2 Demand For Electronic Components
3.3 Market Restraints
3.4 Market Opportunities
3.5 Market Challenges
3.6 Porter’s Five Forces Analysis
3.7 Market Attractiveness Analysis
3.7.1 Market attractiveness analysis By Type
3.7.2 Market attractiveness analysis By End-User/Application
Chapter 4. Global Epoxy Molding Compound Market- Competitive Landscape
4.1 Company market share analysis
4.1.1 Global Epoxy Molding Compound Market: company market share, 2021
4.2 Strategic development
4.2.1 Acquisitions & mergers
4.2.2 New Product launches
4.2.3 Agreements, partnerships, collaborations, and joint ventures
4.2.4 Research and development and Regional expansion
4.3 Price trend analysis
Chapter 5. Global Epoxy Molding Compound Market – Type Analysis
5.1 Global Epoxy Molding Compound Market overview: By Type
5.1.1 Global Epoxy Molding Compound Market share, By Type, 2021 and 2030
5.2 Normal Epoxy Molding Compound
5.2.1 Global Epoxy Molding Compound Market by Normal Epoxy Molding Compound, 2022 – 2030 (USD Million)
5.3 Green Epoxy Molding Compound
5.3.1 Global Epoxy Molding Compound Market by Green Epoxy Molding Compound, 2022 – 2030 (USD Million)
Chapter 6. Global Epoxy Molding Compound Market – End-User/Application Analysis
6.1 Global Epoxy Molding Compound Market overview: By End-User/Application
6.1.1 Global Epoxy Molding Compound Market share, By End-User/Application, 2021 and 2030
6.2 Semiconductor Encapsulation
6.2.1 Global Epoxy Molding Compound Market by Semiconductor Encapsulation, 2022 – 2030 (USD Million)
6.3 Electronic Components
6.3.1 Global Epoxy Molding Compound Market by Electronic Components, 2022 – 2030 (USD Million)
Chapter 7. Epoxy Molding Compound Market – Regional Analysis
7.1 Global Epoxy Molding Compound Market Regional Overview
7.2 Global Epoxy Molding Compound Market Share, by Region, 2021 & 2030 (USD Million)
7.3. North America
7.3.1 North America Epoxy Molding Compound Market, 2022 – 2030 (USD Million)
7.3.1.1 North America Epoxy Molding Compound Market, by Country, 2022 – 2030 (USD Million)
7.4 North America Epoxy Molding Compound Market, by Type, 2022 – 2030
7.4.1 North America Epoxy Molding Compound Market, by Type, 2022 – 2030 (USD Million)
7.5 North America Epoxy Molding Compound Market, by End-User/Application, 2022 – 2030
7.5.1 North America Epoxy Molding Compound Market, by End-User/Application, 2022 – 2030 (USD Million)
7.6. Europe
7.6.1 Europe Epoxy Molding Compound Market, 2022 – 2030 (USD Million)
7.6.1.1 Europe Epoxy Molding Compound Market, by Country, 2022 – 2030 (USD Million)
7.7 Europe Epoxy Molding Compound Market, by Type, 2022 – 2030
7.7.1 Europe Epoxy Molding Compound Market, by Type, 2022 – 2030 (USD Million)
7.8 Europe Epoxy Molding Compound Market, by End-User/Application, 2022 – 2030
7.8.1 Europe Epoxy Molding Compound Market, by End-User/Application, 2022 – 2030 (USD Million)
7.9. Asia Pacific
7.9.1 Asia Pacific Epoxy Molding Compound Market, 2022 – 2030 (USD Million)
7.9.1.1 Asia Pacific Epoxy Molding Compound Market, by Country, 2022 – 2030 (USD Million)
7.10 Asia Pacific Epoxy Molding Compound Market, by Type, 2022 – 2030
7.10.1 Asia Pacific Epoxy Molding Compound Market, by Type, 2022 – 2030 (USD Million)
7.11 Asia Pacific Epoxy Molding Compound Market, by End-User/Application, 2022 – 2030
7.11.1 Asia Pacific Epoxy Molding Compound Market, by End-User/Application, 2022 – 2030 (USD Million)
7.12. Latin America
7.12.1 Latin America Epoxy Molding Compound Market, 2022 – 2030 (USD Million)
7.12.1.1 Latin America Epoxy Molding Compound Market, by Country, 2022 – 2030 (USD Million)
7.13 Latin America Epoxy Molding Compound Market, by Type, 2022 – 2030
7.13.1 Latin America Epoxy Molding Compound Market, by Type, 2022 – 2030 (USD Million)
7.14 Latin America Epoxy Molding Compound Market, by End-User/Application, 2022 – 2030
7.14.1 Latin America Epoxy Molding Compound Market, by End-User/Application, 2022 – 2030 (USD Million)
7.15. The Middle-East and Africa
7.15.1 The Middle-East and Africa Epoxy Molding Compound Market, 2022 – 2030 (USD Million)
7.15.1.1 The Middle-East and Africa Epoxy Molding Compound Market, by Country, 2022 – 2030 (USD Million)
7.16 The Middle-East and Africa Epoxy Molding Compound Market, by Type, 2022 – 2030
7.16.1 The Middle-East and Africa Epoxy Molding Compound Market, by Type, 2022 – 2030 (USD Million)
7.17 The Middle-East and Africa Epoxy Molding Compound Market, by End-User/Application, 2022 – 2030
7.17.1 The Middle-East and Africa Epoxy Molding Compound Market, by End-User/Application, 2022 – 2030 (USD Million)
Chapter 8. Company Profiles
8.1 Sumitomo Bakelite
8.1.1 Overview
8.1.2 Financials
8.1.3 Product Portfolio
8.1.4 Business Strategy
8.1.5 Recent Developments
8.2 Hitachi Chemical
8.2.1 Overview
8.2.2 Financials
8.2.3 Product Portfolio
8.2.4 Business Strategy
8.2.5 Recent Developments
8.3 Chang Chun Group
8.3.1 Overview
8.3.2 Financials
8.3.3 Product Portfolio
8.3.4 Business Strategy
8.3.5 Recent Developments
8.4 Hysol Huawei Electronics
8.4.1 Overview
8.4.2 Financials
8.4.3 Product Portfolio
8.4.4 Business Strategy
8.4.5 Recent Developments
8.5 Panasonic
8.5.1 Overview
8.5.2 Financials
8.5.3 Product Portfolio
8.5.4 Business Strategy
8.5.5 Recent Developments
8.6 Kyocera
8.6.1 Overview
8.6.2 Financials
8.6.3 Product Portfolio
8.6.4 Business Strategy
8.6.5 Recent Developments
8.7 KCC
8.7.1 Overview
8.7.2 Financials
8.7.3 Product Portfolio
8.7.4 Business Strategy
8.7.5 Recent Developments
8.8 Samsung SDI
8.8.1 Overview
8.8.2 Financials
8.8.3 Product Portfolio
8.8.4 Business Strategy
8.8.5 Recent Developments
8.9 Eternal Materials
8.9.1 Overview
8.9.2 Financials
8.9.3 Product Portfolio
8.9.4 Business Strategy
8.9.5 Recent Developments
8.10 Jiangsu Zhongpeng New Material
8.10.1 Overview
8.10.2 Financials
8.10.3 Product Portfolio
8.10.4 Business Strategy
8.10.5 Recent Developments
8.11 Shin-Etsu Chemical
8.11.1 Overview
8.11.2 Financials
8.11.3 Product Portfolio
8.11.4 Business Strategy
8.11.5 Recent Developments
8.12 Hexion
8.12.1 Overview
8.12.2 Financials
8.12.3 Product Portfolio
8.12.4 Business Strategy
8.12.5 Recent Developments
8.13 Nepes
8.13.1 Overview
8.13.2 Financials
8.13.3 Product Portfolio
8.13.4 Business Strategy
8.13.5 Recent Developments
8.14 Tianjin Kaihua Insulating Material
8.14.1 Overview
8.14.2 Financials
8.14.3 Product Portfolio
8.14.4 Business Strategy
8.14.5 Recent Developments
8.15 HHCK
8.15.1 Overview
8.15.2 Financials
8.15.3 Product Portfolio
8.15.4 Business Strategy
8.15.5 Recent Developments
Epoxy Molding Compounds Market Segments
By Type
Normal epoxy molding compound
Green epoxy molding compound
By End-User/Application
Semiconductor encapsulation
Electronic components
By Industry Vertical
Electrical
Automotive
Aerospace
Others
Epoxy Molding Compounds Market Players
Sumitomo Bakelite
Hitachi Chemical
Chang Chun Group
Hysol Huawei Electronics
Panasonic
Kyocera
KCC
Samsung SDI
Eternal Materials
Jiangsu Zhongpeng New Material
Shin-Etsu Chemical
Hexion
Nepes
Tianjin Kaihua Insulating Material
HHCK
Others
